The VSK3000E-U3 is built with SGCC steel ensuring durability for your next build...and the one after that. Furthermore, the VSK3000E-U3 meets Thermally Advantaged Chassis (TAC) 2.0 guidelines and is also equipped with two USB 3.0 ports, Audio In/Out, five drive bays and four expansion slots. Building a system starts with buying a case, then comes the parts that goes into it, which the cost can add up very quickly. The VSK3000E-U3 is here to provide the basic platform to start building your very own system. It?s humble design and practical functionality contains the fundamentals for a performance chassis. The VSK line is designed to be a stepping stone for those who want to upgrade their system later on. Each chassis devotedly serves their purpose as a cost-effective, unforgettable part of your system building experience. Thermally Advantaged Chassis (TAC) 2.0 compliant panel with Chassis Air Guide allows air to flow directly in the path of the CPU fan and heat sink. In addition, the stylish black front panel is now equipped with two USB 3.0 ports for fast data transfer rates up to 5 gbps, Audio In/Out jacks and other computing essentials. Thermally Advantaged Chassis (TAC) 2.0 compliant panel with Chassis Air Guide allows air to flow directly in the path of the CPU fan and heat sink. In addition, the stylish black front panel is now equipped with two USB 3.0 ports for fast data transfer rates up to 5 gbps, Audio In/Out jacks and other computing essentials.